Key insights (AI-powered):
Combining a robotics-optimized SoC, on-module AI acceleration, and modular connectivity, this platform brings greater autonomy and awareness right to the edge. For integrators, it lowers the barriers to deploying multi-sensor, high-vision robots without having to build custom compute stacks, thereby accelerating time to market for service and industrial robotics. For connectivity providers, the plug-in approach strengthens a decoupled architecture in which compute and network are independently selected and supports hybrid LPWAN/5G/Wi-Fi designs. This move underscores a broader IoT trend toward standardized, AI-enabled edge modules as the building blocks for connected robotics.
Quectel introduces the SH602HA-AP intelligent robotic computing module to power the next generation of robotic devices
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of a new generation intelligent robotic computing module, the SH602HA-AP. Based on the D-Robotics Sunrise 5 (X5M) chip platform and with integrated Ubuntu operating system, the module has up to 10 TOPs of computing power from Brain Processing Units (BPU).
Designed for demanding robotic workloads, this high-performance module enables end-to-end computing, supports advanced large-scale models such as Transformer, Bird’s-Eye View (BEV), and Occupancy, and efficiently executes full-stack processing tasks with high performance and reliability.
The module offers exceptional flexibility and works seamlessly with Quectel’s independent LTE Cat 1, LTE Cat 4, 5G, Wi-Fi 6 and GNSS modules to expand connectivity options and enable a wider range of robotics use cases. These include smart displays, express lockers, electrical appliances, industrial control terminals and smart home appliances.
“This module supports edge computing and vision capabilities in robotics applications, among others, as the industry adopts robotic perception to drive the next generation of use cases.” said James Jia, Product Manager, Quectel Wireless Solution.
“This intelligent module’s ability to efficiently perform full-stack computing tasks for robots takes us into a new era and Quectel is proud to help customers build a smarter world.”
Data entry and fusion processing for multiple sensors, including lidar, structured light, time of flight (TOF) and voice, are enabled by the Quectel SH602HA-AP, which fully meets the requirements for AI and vision functions in robotic applications. With dimensions of 40.5mm x 40.5mm x 2.9mm, the module operates in the temperature range of -25°C to +85°C with a standard memory of 4GB plus 32GB and numerous storage options.
The module supports 4K video at 60 frames per second with video encoding and decoding, binocular deep processing, AI and visual simultaneous localization and mapping (VSLAM), speech recognition, 3D point cloud computing and other popular robot perception algorithms. The Quectel SH602HA-AP offers Bluetooth, DSI, RGMII, USB 3.0, USB 2.0, SDIO, QSPI, seven UART, seven I2C and two I2S interfaces
The module easily integrates with additional Quectel modules such as the KG200Z LoRa and the FCS950 Wi-Fi and Bluetooth module, enabling flexible connectivity options.
